| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a three-dimensional shape measurement instrument capable of accurately calculating a height of solder. <P>SOLUTION: An approximation surface of a wiring pattern is prepared for an inspection block prior to application of solder (S22). Furthermore, an approximation surface of lands is prepared for the inspection block prior to the application of solder (S23). Then, based on the prepared approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands, an offset, namely, a distance between the approximation surface Sr of the wiring pattern and the approximation surface Sl of the lands is calculated (S24). The calculated offset is recorded in a RAM or the like (S25). After the application of solder, the stored offset is read out to calculate the height of the solder. <P>COPYRIGHT: (C)2012,JPO&INPIT |
