发明名称 |
SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE |
摘要 |
A semiconductor manufacturing apparatus includes: a treatment chamber treating a treated film of a wafer using a desired chemical fluid; a film thickness measurement unit measuring an initial film thickness of the treated film before treatment and a final film thickness of the treated film after treatment; and a main body controlling unit calculating a treatment speed of the chemical fluid from the initial film thickness, the final film thickness, and a chemical fluid treatment time taken from the initial film thickness to the final film thickness to calculate a chemical fluid treatment time for a wafer to be treated next from the calculated treatment speed.
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申请公布号 |
US2012231562(A1) |
申请公布日期 |
2012.09.13 |
申请号 |
US201213408293 |
申请日期 |
2012.02.29 |
申请人 |
TAKEYA YUKARI;IWAMOTO HAYATO;HAGIMOTO YOSHIYA;MOTOOKA EIZO;SONY CORPORATION |
发明人 |
TAKEYA YUKARI;IWAMOTO HAYATO;HAGIMOTO YOSHIYA;MOTOOKA EIZO |
分类号 |
H01L21/66;B05C11/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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