The present invention comprises: a die pad (301) having at least one cut-out portion (301a) on the peripheral edge thereof, and a projecting portion (301c) which projects sideways from the peripheral edge; an inner lead (302) having a bonding pad (302a) at an end thereof, the bonding pad (302a) being disposed in the cut-out portion (301a) and at an interval from the die pad (301); a semiconductor chip (310) retained on the die pad (301) so that the center position of the semiconductor chip is located closer to the projecting portion (301c) than to the center position of the die pad (301); and a wire (311) for electrically connecting the semiconductor chip (310) and the bonding pad (302a).
