| 摘要 |
<p>An object of the present invention is to provide a method and apparatus for manufacturing a semiconductor device in which a semiconductor wafer after being ground to thin can be picked up safely and surely from a chuck table and transferred to the next step. In the method and apparatus according to the invention, a front surface of a semiconductor wafer is attached by suction on a surface of an attachment plate of a chuck table and a back surface of the semiconductor wafer is ground forming an inside region with a recessed configuration leaving a ring-shaped stiffening portion at the outer peripheral portion of the semiconductor wafer. A procedure to transport the semiconductor wafer having the ring-shaped stiffening portion comprises steps of: pressing the semiconductor wafer from the back surface side to the front surface side thereof on a place different from a place at which the semiconductor wafer is to be held, the step of pressing the semiconductor wafer being conducted before holding the semiconductor wafer having the ring-shaped stiffening portion; releasing the attachment by suction of the front surface of the semiconductor wafer by supplying a positive pressure onto the chuck table; releasing pressing the semiconductor wafer from the back surface side to the front surface side thereof on the place different from the place at which the semiconductor wafer is to be held; and picking up the semiconductor wafer having the ring-shaped stiffening portion from the chuck table while holding the semiconductor wafer.</p> |
