LIGHT EMITTING DIODE CHIP

摘要

PURPOSE: A light emitting diode chip is provided to increase light emitting power by thickly forming light emitting diode assembly. CONSTITUTION: A plurality of protrusions(110) is arranged on the side of a substrate(100) at constant interval. A light emitting diode(200) is included at one surface of the substrate. The light emitting diode comprises a semiconductor structure layer(210), a passivation layer(220), and bumps(242,244). The semiconductor structure layer comprises a first type semiconductor layer(214), an active layer(216), and a second type semiconductor layer(218). An embossed portion(120) is formed on the rear surface of the substrate. The thickness of the substrate is 200 to 400micrometers.