| 摘要 |
The invention provides a photosensitive resin composition which has various excellent performance such as sensitivity, insulation, especially thermal-resistance, therefore, reliability and life in following procedures can be improved; in addition, the photosensitive resin composition can simultaneously form patterns in two modes of insulation body and separator body thereby reducing procedure time as well as markedly increasing opening rate on panel as to be applicable for manufacturing procedures of PM-OLED, AM-OLED, AM-LCD and PDP substrates. The invention related photosensitive resin composition is characterized by containing: a) polyhydroxystyrene resin, b) 1, 2-diazido chinone composite, c) optical acid generating agent, d) cyanurotriamide crosslinking agent, e) solvent. |
