| 摘要 |
The invention relates to a method for a coupling device (1) for connecting an electrical/electronic component (16), in particular a sensor (17), having a substrate, in particular a circuit board, wherein the coupling device (1) comprises at least one electrical connection (25) for electrical contacting and at least one damper element (12) for movement uncoupling, wherein the electrical connection is formed by a lead frame (3) and the lead frame (3) is overmolded in regions by a damping mass (11) as a damper element (12). The invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly. |
