| 摘要 |
PURPOSE: A device for bonding a panel for an electronic component is provided to drastically reduce a space that all manufacturing devices occupy and reduce cost for manufacturing related manufacturing facilities. CONSTITUTION: A panel bonding device(1) includes an opening/closing member(2), a main body(4), a pressurizing member(6), and an airtight maintaining member(7). A first vacuum chamber member(3) is installed on an external side of the opening/closing member of the panel bonding device. A vacuum space(30) is formed in the first vacuum chamber member. A second vacuum chamber member(5) is installed on the external side of the main body of the panel bonding device. A vacuum space(50) is formed in the second vacuum chamber member.
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