MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A manufacturing method for a semiconductor device is provided to fix optical parts on a sensor chip with high precision. CONSTITUTION: A wiring board(2) having an upper side and a lower side is prepared. A plurality of pixels and a sensor chip(3) are loaded on the upper side of the wiring board. A first binder(11a) with first viscosity is arranged on a first main surface of the sensor chip. A first spacer(SP1) with viscosity is formed on the first main surface of the sensor chip. A second binder of a paste shape is arranged on the first main surface of the sensor chip. [Reference numerals] (11a) Adhesive; (2) Wiring board; (23) Bonding frame; (3) Sensor chip; (3a) Surface; (5) Optical component; (SP1) Spacer