SEMICONDUCTOR PACKAGE HAVING CONNECTING MEMBER IN WHICH AMOUNT RATIO OF GOLD IS CONTROLLED

摘要

PURPOSE: A semiconductor package equipped with a connecting member is provided to prevent the destruction of the connecting member by controlling a content ratio of gold of the connecting member which electrically interlinks a base substrate and a semiconductor chip, or semiconductor chips. CONSTITUTION: A bottom pad(13) is placed on the bottom(11) of a base substrate(10). A first semiconductor chip(20) is placed on the base substrate. The first semiconductor chip is sealed by a molding member(50). A first connecting member(30) provides an electrical connecting path between the base substrate and the first semiconductor chip. The first connecting member comprises a bottom pillar(32), a top pillar(34), and a first junction portion(36). The first junction portion has a first gold content ratio. A range of the first gold content ratio is 0.001at% to 24.3at%.