INFRARED DETECTOR WITH SEMI-ACTIVE FOCAL PLANE ARRAY AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An infrared sensor using a Sa-FPA(Semi-Active Focal Plane Array) and a method for manufacturing the same are provided to inspect an operation state of the sensor in advance and to enhance chip density. CONSTITUTION: An infrared sensor using a Sa-FPA comprises a switching unit(310), a wiring routing unit(320), an ROIC(Readout Integrate Circuits) connection pad unit(330), an infrared sensor(400), an address control logic unit(300), and an ROIC chip. The switching unit is formed on a circuit substrate in advance. The wiring routing unit is formed on the circuit substrate in advance and routes electrical signals by being connected to the switching unit. The ROIC connection pad unit is formed on the circuit substrate and connected to the wiring routing unit. The infrared sensor is connected to the switching unit formed in advance by using a monolithic method. The address control logic unit is formed on the circuit substrate in advance and controls the switching unit and the wiring routing unit so that the infrared sensor generates electrical signals by sensing the infrared rays. The ROIC chip is independently manufactured and comprises a sensor chip connection pad unit being connected to the ROIC connection pad, thereby reading the electrical signals generated by the infrared sensor. [Reference numerals] (300) Address control logic unit; (310) Switching unit; (320) Wiring routing unit; (330) ROIC connection pad unit; (400) Infrared sensor