BONNET HEAT INSULATION COVER STRUCTURE FOR VALVE DEVICE,申请号KR20100068442-传众专利搜索

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发明名称	BONNET HEAT INSULATION COVER STRUCTURE FOR VALVE DEVICE
摘要
申请公布号	KR101182089(B1)	申请公布日期	2012.09.11
申请号	KR20100068442	申请日期	2010.07.15
申请人		发明人
分类号	F16K27/12;F16K49/00	主分类号	F16K27/12
代理机构		代理人
主权项
地址

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