Method for forming a circuit pattern

摘要

A method for forming a circuit pattern is disclosed. A circuit pattern that forms an electrically conductive layer (2L) is formed on an insulating resin (11) that forms a first insulating layer (1L). An insulating resin (13) that forms a second insulating layer (3L) is laminated on the insulating resin (11) on which the circuit pattern has been formed. A trench (14) is formed in the laminated insulating resin (13) to expose the circuit pattern. An electroless plating metal (15) is buried by electroless plating in the trench (14) formed.