发明名称 Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus
摘要 A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together.
申请公布号 US8262837(B2) 申请公布日期 2012.09.11
申请号 US20090413846 申请日期 2009.03.30
申请人 MATSUO YASUHIDE;SEIKO EPSON CORPORATION 发明人 MATSUO YASUHIDE
分类号 B29C65/00 主分类号 B29C65/00
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