发明名称 |
Bonding method, bonded structure, liquid droplet discharging head, and liquid droplet discharging apparatus |
摘要 |
A bonding method includes a first process that includes plasmatizing a first gas including a raw gas containing a siloxane (Si—O) bond at a reduced-pressure atmosphere, substituting the first gas by a second gas mainly including an inert gas, and plasmatizing the second gas to form a first plasma polymerized film on at least a part of a base member so as to obtain a first bonded object including the base member and the plasma polymerized film and a second process that includes preparing a second bonded object that is to be bonded to the first bonded object and pressing the first and the second bonded objects against each other such that a surface of the first plasma polymerized film is closely contacted to a surface of the second bonded object to bond the objects together. |
申请公布号 |
US8262837(B2) |
申请公布日期 |
2012.09.11 |
申请号 |
US20090413846 |
申请日期 |
2009.03.30 |
申请人 |
MATSUO YASUHIDE;SEIKO EPSON CORPORATION |
发明人 |
MATSUO YASUHIDE |
分类号 |
B29C65/00 |
主分类号 |
B29C65/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|