发明名称 Method for manufacturing divided waveplate filter
摘要 An adhesive layer is formed on a substrate by printing such that the adhesive layer has a predetermined pattern. A film having a phase-difference characteristic is bonded thereon to form a divided waveplate material layer. The divided waveplate material layer is divided all at once with cutter blades disposed in a row such that the divided waveplate material layer has the predetermined pattern. Then the divided waveplate material layer remaining on portions to be removed is removed, thereby forming divided waveplates on the substrate such that the divided waveplates have the predetermined pattern.
申请公布号 US8262829(B2) 申请公布日期 2012.09.11
申请号 US20030703111 申请日期 2003.11.06
申请人 SATO SEIJI;SEKIZAWA HIDEHIKO;SONY CORPORATION 发明人 SATO SEIJI;SEKIZAWA HIDEHIKO
分类号 B29C65/56;G02B5/30;B32B37/02;B32B37/14;B32B38/04;B32B38/10;C09K19/02;C09K19/52;G02B27/26 主分类号 B29C65/56
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