| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device formed by bonding substrates to each other in which reliability is enhanced by enhancing adhesion of the bonded surfaces thereby reducing the peeling and chipping of wafers, and to provide an electronic apparatus using that semiconductor device. <P>SOLUTION: An embedded film 57 is formed to bury a step on a wiring layer 33 formed on the boundary of the peripheral region 53 of a first semiconductor wafer 31 and an inner region 54 on the inside of the peripheral region 53, thus making the surface of the wiring layer 33 substantially flush in the peripheral region 53 and the inner region 54. The first semiconductor wafer 31 and a second semiconductor wafer 43 are then bonded while the surface of the wiring layer 33 formed on the first semiconductor wafer 31 and a desired surface of the second semiconductor wafer 43 being maid to face each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
