| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve sensitivity of a pad of an input device. <P>SOLUTION: A pad structure of an input device comprises: a base material facing outside that is an operation surface of the input device; a substrate that is placed opposite to the base material inside of the input device; a pad that is placed opposite to the base material on the substrate and that detects electrostatic capacity; and a dielectric member that is placed between the pad and the base material. The pad and the dielectric member are bonded with conductive adhesion means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
