发明名称 |
DEPOSITION METHOD, DEPOSITION APPARATUS, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a deposition method and a deposition apparatus of a cobalt film having low solubility into a plating liquid and excellent in barrier property against Cu diffusion in a single film. <P>SOLUTION: A deposition method of a carbon-containing cobalt film comprises: a process of conveying a wafer W into a processing chamber 1 of a deposition apparatus 100 and arranging the wafer W on a stage 3; a process of adjusting a pressure in the processing chamber 1 and a temperature of the wafer W; a process of depositing the carbon-containing cobalt film on a surface of the wafer W in a CVD method by supplying and mixing Co<SB POS="POST">2</SB>(CO)<SB POS="POST">8</SB>and acetylene in the processing chamber 1; a process of stopping supply of a deposition material and vacuuming the processing chamber 1; and a process of conveying the wafer W from the processing chamber 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012174844(A) |
申请公布日期 |
2012.09.10 |
申请号 |
JP20110034503 |
申请日期 |
2011.02.21 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
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分类号 |
H01L21/285;C23C16/16;H01L21/28;H01L21/768 |
主分类号 |
H01L21/285 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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