发明名称 EBULLIENT COOLING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an ebullient cooling apparatus for reducing heat resistance. <P>SOLUTION: The ebullient cooling apparatus 1 includes: a hollow heat receiving part 3 for receiving heat from outside; a hollow heat radiation part 4 for radiating heat outside; a refrigerant filling body 2 having a refrigerant communication part 5 which communicates insides of the heat receiving part 3 and the heat radiation part 4 with each other; and a refrigerant 6 which is filled in the refrigerant filling body 2, is stored in the heat receiving part 3, and transports heat as latent heat. The refrigerant 6 comprises mixed liquid of fluorocarbon and hydrocarbon. The content of the hydrocarbon in the mixed liquid ranges from 30 to 90 mass%, and preferably from 40 to 70 mass%. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012172866(A) 申请公布日期 2012.09.10
申请号 JP20110033032 申请日期 2011.02.18
申请人 SHOWA DENKO KK 发明人
分类号 F28D15/02 主分类号 F28D15/02
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