| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure capable of enhancing conduction reliability between electrodes. <P>SOLUTION: The method of manufacturing a connection structure 1 includes: a step in which an anisotropic conductive material layer 3A is disposed on a first connecting object member 2 having an electrode 2b on an upper surface 2a thereof; a step in which light is irradiated on the anisotropic conductive material layer 3A to promote curing of the anisotropic conductive material layer 3A and the anisotropic conductive material layer 3A is changed into an anisotropic conductive material layer 3B of a B-stage; and a step in which a second connecting object member 4 having an electrode 4b on a lower surface 4a thereof is further laminated on a surface 3a of the anisotropic conductive material layer 3B of the B-stage. When the anisotropic conductive material layer 3A is changed into the anisotropic conductive material layer 3B of the B-stage, a storage elastic modulus G' at a temperature showing the minimum melting viscosity in a temperature range of 23 to 120°C of the anisotropic conductive material layer 3B of the B-stage is made to be 5×10<SP POS="POST">2</SP>Pa or more and 1×10<SP POS="POST">5</SP>Pa or less. A compression modulus when a conductive particle 5 is compressively deformed by 20% at 170°C is 5.9×10<SP POS="POST">2</SP>N/mm<SP POS="POST">2</SP>or more and 5.9×10<SP POS="POST">3</SP>N/mm<SP POS="POST">2</SP>or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
