| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device that resists damage when a wafer is cut into separate piezoelectric devices and that allows measurement and adjustment of frequency of each of crystal vibrating pieces on a wafer, and to provide a method for manufacturing the piezoelectric device. <P>SOLUTION: A piezoelectric device (100) includes: a first rectangular plate (12) that forms part of a package for housing a vibrating portion (10) and that has a pair of first linear sides (L1) and a pair of second linear sides (L2) perpendicular to the first sides (L1); a second rectangular plate (11) that is bonded to the first plate (12) and forms a part of the package for housing the vibrating portion (10); and an adhesive (LG) that includes a glass material and bonds the first plate (12) and the second plate (11) together. In each of the pair of first sides (L1), a pair of castellations (122) are formed that are recessed inward from an outer edge thereof. The pair of castellations (122) are arranged in two respective regions divided by a line (Ax) that passes through center of the first plate (12) and is parallel to the second sides (L2). <P>COPYRIGHT: (C)2012,JPO&INPIT |
