| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package that is excellent in heat radiation ability. <P>SOLUTION: A semiconductor package 1 comprises: a first semiconductor chip 101 that is disposed on a base 102 and includes a first electrode 112; a first heat radiation block 108 that is disposed on the upper part of the first semiconductor chip 101 including the upper part of the first electrode, at a distance shorter than the thickness of the first semiconductor chip 101 away from the top surface of the first semiconductor chip 101 and is equal in size to the entire top surface of the first semiconductor chip 101; a terminal lead 105 that includes a first end that is curved from the first electrode toward the upper part of the semiconductor chip 101 to avoid the first heat radiation block 108 and is connected to the first electrode, and a second end connected to an electric source; and a resin part 110 that covers the first semiconductor chip 101 and forms the top surface of the first heat radiation block 108 and the end connected to the electric source in the terminal lead 105 so as to expose the top surface and the end in a direction of the upper part of the semiconductor chip 101. <P>COPYRIGHT: (C)2012,JPO&INPIT |
