| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a connection failure from being caused by solder flowing on a silver surface treatment formed as a reflection film of light, and to prevent a reflectance from being deteriorated. <P>SOLUTION: An LED package substrate includes metal foil formed by applying the silver surface treatment functioning as a reflector onto a bent metal plate through an insulation layer. After an LED chip is mounted and wired on the LED package substrate, excepting openings for connection electrodes, a transparent protective film is applied so as to cover the top face of the LED package substrate including at least the silver surface treatment face, and the LED package is formed by filling the transparent resin. The LED package is mounted to a wiring board, and a pair of connection electrodes are soldered to the wiring of the wiring board through the openings of the transparent protective film for connection electrodes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
