发明名称 COMPOUND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor device with both a high breakdown voltage characteristic and a low on-resistance characteristic. <P>SOLUTION: A compound semiconductor device includes: a nitride semiconductor laminate structure 4 including a carrier travel layer 2 and a carrier supply layer 3; a source electrode 5 and a drain electrode 6 provided above the nitride semiconductor laminate structure; a gate electrode 7 provided between the source electrode and the drain electrode above the nitride semiconductor laminate structure; a field plate 8 at least a part of which is provided between the gate electrode and the drain electrode; and a plurality of insulation films 9 and 10 formed above the nitride semiconductor laminate structure. The number of interfaces of the plurality of insulation films is smaller between the field plate and the drain electrode than in the vicinity of the gate electrode. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175018(A) 申请公布日期 2012.09.10
申请号 JP20110037900 申请日期 2011.02.24
申请人 FUJITSU LTD 发明人 TAGI TOSHIHIRO
分类号 H01L21/338;H01L21/28;H01L21/336;H01L29/41;H01L29/778;H01L29/78;H01L29/786;H01L29/812 主分类号 H01L21/338
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