| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip-like electronic component exhibiting high moisture resistance and a low process load. <P>SOLUTION: The chip-like electronic component 1 comprises a substantially rectangular parallelepiped component body 10 with an embedded internal electrode 11, and an external electrode 20 formed on the outer surface of the component body 10 and brought into conduction with the internal electrode 11. A silicon nitride based thin film 30 is formed on the outer surface of the component body 10 excepting a part where the external electrode is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
