发明名称 SPUTTERING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an inexpensive sputtering apparatus having excellent workability which preferably forms a thin film made of various material on the whole surface of an object to be treated having various shapes and material kinds. <P>SOLUTION: In the sputtering apparatus, a barrel 5 for storing the object 3 to be treated and a sputtering cathode 7 having a target surface are disposed in a vacuum vessel 1. The object to be treated in the barrel is rolled and mixed by applying the movement assembling rotation, forward/backward movement and rocking to the barrel, thereby film forming of a target material is performed on the total surface of the object to be treated. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012172240(A) 申请公布日期 2012.09.10
申请号 JP20110037979 申请日期 2011.02.24
申请人 IKUSEI RIKA KOGYO:KK 发明人 SASAKI TAKASHI;MIYAJIMA SHIN
分类号 C23C14/34 主分类号 C23C14/34
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