| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package integrating a plurality of semiconductor chips or semiconductor packages into one package and including an interposer having a through substrate via, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor package 1 including an interposer 120 having a via 122, has: a lower semiconductor package 100 including a lower base substrate 110, the interposer 120 located on the lower base substrate 110 and having the via 122, and a lower semiconductor chip 130 mounted on the interposer 120 and electrically coupled to the interposer 120; an upper semiconductor package 200 located on the lower semiconductor package 100 and including an upper semiconductor chip 230; a package coupling member 260 located on the interposer 120, and electrically coupling the upper semiconductor package 200 with the interposer 120; and an outside molding member 170 tightly sealing the interposer 120. The size of the semiconductor package 1 can be reduced. <P>COPYRIGHT: (C)2012,JPO&INPIT |
