发明名称 METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a connection structure capable of improving connection reliability of first and second connection target members. <P>SOLUTION: A method for manufacturing a connection structure 1 according to the present invention includes a step for linearly applying a curable composition containing a thermosetting component on a first connection target member 2 to form a curable composition layer; a step for laminating a second connection target member 4 smaller than the first connection target member 2 on the curable composition layer; and a step for heating the curable composition layer and finally hardening it to form a cured material layer 3. In the method for manufacturing the connection structure 1 according to the present invention, when minimum thickness (&mu;m) of a center part 3x of the curable composition layer in a direction orthogonal to an application direction is designated as T, the curable composition is linearly applied so that maximum thickness (&mu;m) of an outer edge 3y of the center part 3x of the curable composition layer in a direction orthogonal to the application direction is 1.1 T or more and 1.6 T or less, and so that the edge 3y has a swollen shape. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175048(A) 申请公布日期 2012.09.10
申请号 JP20110038430 申请日期 2011.02.24
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI;MAHARA SHIGEO
分类号 H01L21/60;H01L21/56 主分类号 H01L21/60
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