| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat sink which achieves high cooling performance and has an outer layer serving as an electrode for applying voltage to a semiconductor element, and to provide a manufacturing method of the heat sink. <P>SOLUTION: A heat sink 100 includes a laminated body 12 provided at a passage 9a for refrigerant circulation. The laminated body 12 is formed by a metal and includes: a tube body 9 forming the passage 9a on the inner side; an insulation layer 10 formed on the outer side of the tube body 9; and a conductor 11 which is formed on the outer side of the insulation layer 10 and has an upper surface 11a serving as a joined surface to which an electrode of a semiconductor element 1 that is cooled, for example an emitter electrode 1b, is joined, on a surface of the conductor 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
