| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a semiconductor integrated circuit module, a radio communication module and a radio communication device capable of preventing falling of a substrate and damages of a semiconductor circuit chip and a radio IC chip as much as possible without spoiling flexibility of a base substrate. <P>SOLUTION: A semiconductor integrated circuit module (radio communication module) includes: a flexible substrate 15; a semiconductor circuit chip (radio IC chip 10) provided on the flexible substrate 15; a coil pattern 20 which is formed on the flexible substrate 15 and coupled to the semiconductor circuit chip (radio IC chip 10); and a reinforcement member (interlayer conductor 26) for reinforcing strength of the flexible substrate 15. The interlayer conductor 26 consists of a metal material, and is provided by including a gap for transmitting magnetic flux to be generated by the coil pattern 20 in an area which is a partial area of the flexible substrate 15 and an area opposite to the bottom of the semiconductor circuit chip (radio IC chip 10) and/or the surrounding area of the area. <P>COPYRIGHT: (C)2012,JPO&INPIT |
