| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a metal plate low resistance chip resistor which improves adhesiveness with a protective film and an electrode film. <P>SOLUTION: A method for manufacturing the metal plate low resistance chip resistor comprises the steps of: preparing a low resistance metal plate 10 having a predetermined width and thickness; sand blast working the surface of the metal plate 10; forming insulating protective films 11a and 11b having a predetermined width at center parts of a top and a bottom surface of the metal plate 10, respectively, along a longitudinal direction of the metal plate 10; and forming an electrode layer in which a front electrode 12a, a back electrode 12c and an end face electrode 12b are integrated, by electroplating on the metal plate 10 at both sides of the protective films 11a and 11b. Thereby, fine unevenness occurs on the surface of the low resistance metal plate by sand blast working, and accordingly adhesion strength of the protective films 11a and 11b and the electrode layers 12a, 12c and 12b formed on the surface of the metal plate after the plate has been sand blast worked increases with respect to the surface of the metal plate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
