发明名称 COMPONENT MOUNTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting device capable of properly coping with a diversified surface mounting manufacturing processes, and realizing mounting of a component in a short time. <P>SOLUTION: The component mounting device has an operation sequence control process described in a compiler type language that regulates a series of sequence operations including sucking, recognition, and mounting of a component. A component is mounted on a circuit board that has been carried in and then is carried out according to the result of the operation sequence control process. The operation sequence control process includes an interpreter type language processing execution routine (step S17) which is described in an interpreter type language for executing a custom program that regulates an operation that is different from the series of sequence operations, and a switching process (step S12) which switches interpreter type language process routines during, or before/after, the series of sequence operations according to a custom program specification information that specifies execution of a custom program. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175026(A) 申请公布日期 2012.09.10
申请号 JP20110037991 申请日期 2011.02.24
申请人 YAMAHA MOTOR CO LTD 发明人
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址