发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To inhibit a short circuit between contact plugs formed in such a way as to sandwich a butting part of gate electrodes, via voids formed in an insulation film of the butting part. <P>SOLUTION: On each of sidewalls SW facing at a butting part of gate electrodes G2 and G5, a liner insulation film 6 and an interlayer insulation film 7 are formed. Between the sidewalls SW, voids are prevented from occurring inside the interlayer insulation film 7 and the liner insulation film 6 by contacting the liner insulation films 6 formed on respective lateral walls of the sidewalls SW to block a clearance between the sidewalls SW. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012174910(A) 申请公布日期 2012.09.10
申请号 JP20110035968 申请日期 2011.02.22
申请人 RENESAS ELECTRONICS CORP 发明人 TAKEUCHI MASAHIKO
分类号 H01L21/768;H01L21/28;H01L21/8244;H01L27/11 主分类号 H01L21/768
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