| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which suppresses diffusion of processing liquid over a substrate when a foreign matter on the substrate such as a semiconductor wafer is cleaned with the processing liquid discharged from a processing fluid nozzle, and allows the foreign matter after being separated from the substrate to be effectively removed beyond the substrate. <P>SOLUTION: A substrate processing apparatus includes a diffusion suppression section which is disposed to surround the periphery of a processing fluid nozzle, and is formed in a shape having an opening in one direction, and is configured to release gas with respect to a substrate; and a movement section for moving the diffusion suppression section. When the processing liquid is discharged from the processing fluid nozzle, the movement section moves the diffusion suppression section so that the opening of the diffusion suppression section is oriented to a peripheral edge of the substrate. This suppresses damage on the substrate due to the diffusion of the processing liquid, thereby allowing the processing liquid and the foreign matter to be effectively removed beyond the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
