| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent damage to a semiconductor substrate having a through electrode during lamination of the semiconductor substrate. <P>SOLUTION: A first substrate 10 where a through electrode 40 is formed is laminated onto a second substrate 100 where a bump electrode 117 is formed. The through electrode 40 has a recess 28. In the lamination, the bump electrode 117 is inserted into the recess 28. The apex width of the bump electrode 117 is smaller than the open width of the recess 28. <P>COPYRIGHT: (C)2012,JPO&INPIT |
