发明名称 METHOD FOR PRODUCING DISPLACEMENT PLATING PRECURSOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for producing a displacement plating precursor which can form a Cu monatomic layer on the surface of Pt particle or Pt alloy particle without using any external electric source. <P>SOLUTION: The method for producing a displacement plating precursor comprises a deposition step of depositing the Cu layer on the surface of the core particle by bringing an aqueous acid solution containing Cu ions into contact with at least a part of a Cu electrode, bringing a core particle comprising Pt or a Pt alloy or a composite composed of the core particle carried by an electroconductive carrier into contact with the Cu electrode in the aqueous acid solution or outside the aqueous acid solution, and bringing the core particle into contact with the aqueous acid solution in an inert gas atmosphere. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012172162(A) 申请公布日期 2012.09.10
申请号 JP20110032554 申请日期 2011.02.17
申请人 TOYOTA CENTRAL R&D LABS INC;TOYOTA MOTOR CORP 发明人 MURATA HAJIME;NAGAI TOMOYUKI;MORIMOTO TOMO;IGAI TOSHIHIRO
分类号 C23C18/54;H01M4/88;H01M4/92 主分类号 C23C18/54
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