| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique for making a solid state image pickup device compact while reducing unnecessary light reaching a pixel region of the solid state image pickup device. <P>SOLUTION: There is provided the solid state image pickup device including a semiconductor chip which has a main surface including the pixel region; a projection which is arranged on the main surface of the semiconductor chip so as to surround the pixel region; a cover member with light permeability which is arranged where the pixel region is covered; and an adhesive which surrounds the pixel region so as to form an internal space between the semiconductor chip and cover member, and bonds the cover member and projection together. The projection has an upper surface and a first side face facing the space, and a first ridge is formed of the upper surface and first side face; and the adhesive bonds the upper surface of the projection and the cover member together and has a first surface facing the internal space, the first surface extends from the first ridge to the cover member, and an outer periphery of the internal space on a plane parallel with the main surface becomes shorter from the upper surface of the projection to the cover member. <P>COPYRIGHT: (C)2012,JPO&INPIT |
