| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure in which the excessive expansion of an anisotropic conductive material is suppressed, displacement between electrodes is suppressed, and furthermore conduction reliability is enhanced. <P>SOLUTION: In the method of manufacturing a connection structure 1, on an upper surface of an anisotropic conductive material layer disposed on a first connecting object member 2 having an electrode 2b on an upper surface 2a thereof, a second connecting object member 4 having an electrode 4b on a lower surface 4a thereof is laminated, and after a laminate 1A composed of the first connecting object member 2, the anisotropic conductive material layer, and the second connecting object member 4 is obtained, then the anisotropic conductive material layer is cured, and the laminate 1A is crimped under a pressure of 1.9 MPa or less. In the method of manufacturing the connection structure 1, the minimum melting viscosity at 60 to 200°C of the anisotropic conductive material layer in the laminate 1A before being crimped is made to be 500 Pa s or more and less than 3,000 Pa s. <P>COPYRIGHT: (C)2012,JPO&INPIT |
