发明名称 MANUFACTURING METHOD OF WIRING BOARD, INK SET FOR CONDUCTOR PATTERN FORMATION AND WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a highly reliable wiring board including a highly reliable conductor pattern, for which generation of cracks, disconnection and a short-circuit or the like is prevented. <P>SOLUTION: A manufacturing method of a wiring board of this invention includes: a step of preparing a sheet-like temporary compact constituted of a material containing a ceramic material and a binder; a step of obtaining a ceramic compact with a region containing a condensate of polyalcohol formed near a surface by imparting a composition containing the condensate of the polyalcohol to the temporary compact; a step of forming a conductor pattern precursor by discharging ink for conductor pattern formation containing metal particles and a dispersion medium in which the metal particles are dispersed by a droplet discharge method to the region containing the condensate of the polyalcohol of the ceramic compact; a step of obtaining a laminate by laminating the plurality of ceramic compacts; and a calcination step of calcining the laminate and obtaining the wiring board having a conductor pattern and a ceramic substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175082(A) 申请公布日期 2012.09.10
申请号 JP20110038878 申请日期 2011.02.24
申请人 SEIKO EPSON CORP 发明人
分类号 H05K3/10;H01B13/00;H05K1/09;H05K3/46 主分类号 H05K3/10
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