| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for which a filler is appropriately filled in a gap between a semiconductor element and a tape base material without causing failures of non-filling, air bubbles or the like, and its manufacturing method. <P>SOLUTION: A semiconductor device 100 includes: a wiring pattern 104; a semiconductor element 108 electrically connected with the wiring pattern 104; a front surface side insulation protective film 106 covering a front surface of the tape base material 102 and having a front surface side opening 106a in a region opposite to the semiconductor element 108; and a back surface side insulation protective film 112 covering a back surface of the tape base material 102 and having a back surface side opening 112a at a part to be a back side of the front surface side opening 106a. The front surface side insulation protective film 106 has a projected opening 106b projected more to the outer side than the opposite region. The back surface side opening 112a has a size of 1.00 to 8.50 times of the region opposite to the semiconductor element 108 on the front surface of the tape base material 102. <P>COPYRIGHT: (C)2012,JPO&INPIT |
