发明名称 PLATING APPARATUS AND PLATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plating apparatus in which high current can be passed, the inner part of a porous body can be sufficiently plated, and furthermore the maintainability of a feed part is excellent, and a plating method using the same. <P>SOLUTION: The plating apparatus for continuously electroplating a long band to which conductivity is imparted includes: a plating bath in which a plating solution is stored; a rotating drum at least a part of which is immersed in the plating solution; an anode which is arranged at a predetermined interval from the rotating drum in the plating bath; a metal belt, the whole of which is rotated in a loop by a rotating means, and which rotates such that the metal belt passes between the rotating drum and the anode in the state where the lower part thereof presses the rotating drum; a transportation means which conveys the long band in the state where it is pressed to the rotating drum and the metal belt; and a feed part and a power supply part. The metal belt is provided with protruded electrodes on the periphery side thereof and is configured so that electric power is supplied to the metal belt from the feed part. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012172220(A) 申请公布日期 2012.09.10
申请号 JP20110036941 申请日期 2011.02.23
申请人 SUMITOMO ELECTRIC IND LTD 发明人
分类号 C25D21/00;C25D7/06 主分类号 C25D21/00
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