| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can prevent a heating and pressurizing tool from being tainted and improve yield without causing occurrence of failure in a tool protection material preventing connection materials from being adhered to the heating and pressurizing tool when manufacturing the semiconductor device by connecting electronic components. <P>SOLUTION: When a semiconductor device is manufactured by heating and pressurizing a first electronic component 1 by a heating and pressurizing tool 3 with connection materials 4 sandwiched between the first electronic component 1 and a second electronic component 2 which face each other to connect the first electronic component 1 and the second electronic component 2, heating and pressurizing are performed by intervening a tool protection material 5 having a dimension equivalent to that of a heating and pressurizing surface 31 of the heating and pressurizing tool 3 and composed of any one of a metal foil, a silicon chip and a ceramic sheet, between the heating and pressurizing surface 31 of the heating and pressurizing tool 3 and a rear face 13 that is a heated and pressurized surface of the first electronic component 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
