发明名称 INSTRUMENT ATTACHMENT FRAME AND INSTRUMENT ATTACHMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an instrument attachment frame which has superior operability. <P>SOLUTION: An instrument attachment frame 1 includes a bending part 13 for folding a frame 11 so as to pass through a through hole H bored in a panel material W1 to the back R of a wall. The frame body 1 has an insertion space S into which a cable C can be inserted when the frame 11 is folded at the bending part 13. The frame is folded so as to form the insertion space S, and consequently while the cable C is inserted into the insertion space S, the instrument attachment frame 1 can be passed through the through hole H bored in the panel material W1. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175886(A) 申请公布日期 2012.09.10
申请号 JP20110038529 申请日期 2011.02.24
申请人 MIRAI IND CO LTD 发明人 WATANABE YOSHIKI
分类号 H02G3/02;H01R13/46 主分类号 H02G3/02
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