发明名称 LIQUID EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which allows the cured article thereof to have low elasticity and high toughness while keeping the liquid property and reactivity caused by making the viscosity low. <P>SOLUTION: The epoxy resin composition is a liquid at a normal temperature and contains as a composition component (a) an epoxy resin which is liquid at a normal temperature, (b) a polyvinyl acetal-based modifier, (c) a curing agent and a curing accelerator and (d) a filler, wherein the blend ratio of the polyvinyl acetal-based modifier is in the range of 0.5-20 pts.mass per 100 pts.mass epoxy resin liquid at normal temperatures and 0.5-7 mass% per total quantity of the liquid epoxy resin composition. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012172054(A) 申请公布日期 2012.09.10
申请号 JP20110035209 申请日期 2011.02.21
申请人 PANASONIC CORP 发明人 KISANUKI ATSUSHI
分类号 C08L63/00;C08G59/50;C08L29/14;H01L21/52;H01L23/29;H01L23/31 主分类号 C08L63/00
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