| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a microphone, in which the plane area as viewed from above can be reduced and the volume of a back chamber of an acoustic sensor can be increased. <P>SOLUTION: An interposer 52 is mounted on the upper surface of a circuit board 43 and an acoustic sensor 51 is mounted on the upper surface of the interposer 52. A signal processing circuit 53 is accommodated in a space 70 provided in the interposer 52 and mounted on the circuit board 43. The acoustic sensor 51 is connected to the circuit board 43 through a wiring structure provided in the interposer 52. The acoustic sensor 51 and the interposer 52 and the like are covered with a cover 42 placed over the upper surface of the circuit board 43. A sound inlet hole 48 is opened in the cover 42 at a position facing a front chamber of the acoustic sensor 51. A venting notch 71 is formed in the interposer 52 to allow the space below a diaphragm 56 of the acoustic sensor 51 to acoustically communicate with the space outside the interposer 52 within the cover 42. <P>COPYRIGHT: (C)2012,JPO&INPIT |
