| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical transmitter module having such structure as can prevent the heat generated by a DC current supplied to an optical semiconductor element inside a TO-CAN package from affecting a high frequency electric signal which is conductive to the optical semiconductor element. <P>SOLUTION: The optical transmitter module includes a TO-CAN package 13 and an FPC substrate 12. A coaxial pin 22 that is arranged in the TO-CAN package 13 is connected to an RF signal line 26 arranged on the surface of the FPC substrate 12. A high frequency electric signal is made to be conductive to an optical semiconductor element arranged inside the TO-CAN package 13 from the RF signal line 26 by way of a coaxial pin 22. A plurality of DC pins 23 arranged at the TO-CAN package 13 are bent, to be connected to a DC signal line arranged on the rear surface of the FPC substrate 12. DC current is made to be conductive to the optical semiconductor element from the DC signal line by way of the DC pin 23 which is away from the coaxial pin 22 by 3 mm or more and 7.4 mm or less, among the plurality of DC pins 23. <P>COPYRIGHT: (C)2012,JPO&INPIT |
