LEAD-FREE SOLDER ALLOY FOR VEHICLE GLASS

摘要

This lead-free solder alloy for vehicle glass comprises an alloy composition of 26.0-56.0 mass% of In, 0.1-5.0 mass% of Ag, 0.002-0.05 mass% of Ti, and 0.001-0.01 mass% of Si, the remainder being Sn. Furthermore, the alloy may contain 0.005-0.1 mass% of Cu and 0.001-0.01 mass% of B. The solder alloy is particularly favorable in vehicle glass applications, and has superior adhesion strength to glass, acid resistance, salt water resistance, and temperature cycling resistance.