发明名称 FILM SURFACE TREATMENT METHOD AND DEVICE
摘要 <p>A film (9) to be treated is supported by a support section (10) of a film surface treatment device (1). A first gas (g1) containing a polymerizable monomer is brought into contact with the film (9) by means of a first treatment section (91). Next, a second gas (g2) containing a discharge product gas is transformed into plasma by means of a second treatment section (92) and the plasma is brought into contact with the film (9). Next, a third gas (g3) containing a polymerizable monomer is brought into contact with the film (9) by means of a third treatment section (93). Next, a fourth gas (g4) containing a discharge product gas is transformed into plasma by means of a fourth treatment section (94) and the plasma is brought into contact with the film (9). An additive component is further added to the third gas (g3) or the fourth gas (g4). The additive component is an oxygen gas, a hydrogen gas, a saturated hydrocarbon gas, an unsaturated hydrocarbon gas, or a crosslinking accelerator agent. In this manner, it becomes possible to improve the adhesion durability of a resin film.</p>
申请公布号 WO2012117933(A1) 申请公布日期 2012.09.07
申请号 WO2012JP54397 申请日期 2012.02.23
申请人 SEKISUI CHEMICAL CO., LTD.;NAKANO YOSHINORI;SATOH TAKASHI;MURAKAMI JUNNOSUKE 发明人 NAKANO YOSHINORI;SATOH TAKASHI;MURAKAMI JUNNOSUKE
分类号 C08J7/04;C08F2/00;G02B5/30 主分类号 C08J7/04
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