| 摘要 |
<p>Disclosed is a module for in-line identification of weak items (14) of sheet material as they pass along a moving line of such items, including provision (17, 18) to apply twist to the items as they pass along the line by applying bending in two generally diagonal directions, in which the applied degree of twist is such that it will not crack items with sufficient strength to provide acceptable products, so that after satisfactorily resisting the applied twist, acceptable wafers continue along the moving line, and after breakage or cracking unacceptable wafers can be removed from the line.</p> |
