| 摘要 |
The present invention encompasses an electronic device (50) comprising an electrically conductive core layer (10) with a first layer (16) composed of electrically conductive material, said first layer being applied on both sides, and with at least one electronic component (20) arranged in a cutout (18) of the first layer (16), wherein the first layer (16) is covered in each case with an electrically insulating, thermally conductive layer (34, 36) and a further layer (22, 26) composed of electrically conductive material is provided in each case on the thermally conductive layer (34, 36), said further layer being coated in each case with a covering layer (38) composed of electrically conductive material, and furthermore having plated-through holes (24) composed of the material of the covering layer (38), which extend through the electrically insulating, thermally conductive layer (36) covering the electronic component (20) and the further layer (22) composed of electrically and thermally conductive material for the purpose of making contact with the electronic component (20). |
